1. 2. 3. material content data sheet sales product name tle7234em issued 28. august 2013 ma# MA000982088 package pg-ssop-24-4 weight* 150.84 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.306 2.85 2.85 28546 28546 leadframe inorganic material phosphorus 7723-14-0 0.017 0.01 111 non noble metal zinc 7440-66-6 0.067 0.04 446 non noble metal iron 7439-89-6 1.345 0.89 8917 non noble metal copper 7440-50-8 54.617 36.21 37.15 362087 371561 wire noble metal gold 7440-57-5 0.478 0.32 0.32 3167 3167 encapsulation organic material carbon black 1333-86-4 0.171 0.11 1136 plastics epoxy resin - 7.881 5.22 52247 inorganic material silicondioxide 60676-86-0 77.609 51.46 56.79 514517 567900 leadfinish non noble metal tin 7440-31-5 2.911 1.93 1.93 19298 19298 plating noble metal silver 7440-22-4 0.234 0.16 0.16 1553 1553 glue plastics epoxy resin - 0.301 0.20 1994 noble metal silver 7440-22-4 0.902 0.60 0.80 5981 7975 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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